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[IEEE 2012 IEEE International Symposium on Electromagnetic Compatibility - EMC 2012 - Pittsburgh, PA, USA (2012.08.6-2012.08.10)] 2012 IEEE International Symposium on Electromagnetic Compatibility - Modeling of coupled TSVs in 3D ICs

✍ Scribed by Engin, A. Ege; Raghavan, N. Srinidhi

Book ID: 127340480
Publisher: IEEE
Year: 2012
Weight: 401 KB
Category: Article
ISBN: 1467320595
DOI: 10.1109/isemc.2012.6351759

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