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[IEEE 2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) - La Jolla, CA, USA (2012.10.14-2012.10.17)] 2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) - Diamond Materials for GaN HEMT near Junction Heat Removal

✍ Scribed by Sandhu, Rajinder; Gambin, Vincent; Poust, Benjamin; Smorchkova, Ioulia; Lewis, Gregg; Elmadjian, Raffi; Li, Danny; Geiger, Craig; Heying, Ben; Wojtowicz, Mike; Oki, Aaron; Feygelson, Tatyana; Hobart, Karl; Bozorg-Grayeli, Elah; Goodson, Kenneth

Book ID: 120166730
Publisher: IEEE
Year: 2012
Weight: 157 KB
Category: Article
ISBN: 1467309273
DOI: 10.1109/CSICS.2012.6340119

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