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[IEEE 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Xian, China (2012.10.29-2012.11.1)] 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology - Major influence of Ti/TiN and TTN metal barrier layer deposition on electro-migration resistivity

✍ Scribed by Xu, Wei; Liao, Scott; Jiang, Ling; Yang, Jian; Yu, Chao

Book ID: 120084631
Publisher: IEEE
Year: 2012
Weight: 774 KB
Category: Article
ISBN: 1467324736
DOI: 10.1109/ICSICT.2012.6467650

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