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[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Cooling power optimization for hybrid solid-state and liquid cooling in integrated circuit chips with hotspots

✍ Scribed by Yazawa, Kazuaki; Ziabari, Amirkoushyar; Yee Rui Koh, ; Shakouri, Ali; Sahu, Vivek; Fedorov, Andrei G; Joshi, Yogendra

Book ID: 120048159
Publisher: IEEE
Year: 2012
Weight: 902 KB
Category: Article
ISBN: 1424495318
DOI: 10.1109/ITHERM.2012.6231419

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