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[IEEE 2012 10th IEEE International Conference on Semiconductor Electronics (ICSE) - Kuala Lumpur, Malaysia (2012.09.19-2012.09.21)] 2012 10th IEEE International Conference on Semiconductor Electronics (ICSE) - Temperature cycling and thermal shock correlation in DPAK & DSO packages

✍ Scribed by Ying, Lee Chai; Fei, Cheong Choke

Book ID: 125425948
Publisher: IEEE
Year: 2012
Weight: 1006 KB
Category: Article
ISBN: 1467323942
DOI: 10.1109/smelec.2012.6417185

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