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[IEEE 2011 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Hsinchu, Taiwan (2011.04.25-2011.04.27)] Proceedings of 2011 International Symposium on VLSI Technology, Systems and Applications - Copper interconnect technology for the 22 nm node

✍ Scribed by Gambino, J. P.

Book ID: 126678467
Publisher: IEEE
Year: 2011
Weight: 102 KB
Category: Article
ISBN: 1424484936
DOI: 10.1109/VTSA.2011.5872228

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