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[IEEE 2011 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) - Hsinchu, Taiwan (2011.04.25-2011.04.28)] Proceedings of 2011 International Symposium on VLSI Design, Automation and Test - A study on the trade-off among wirelength, number of TSV and placement with different size of TSV

✍ Scribed by Tsai, Ming-Chao; Hwang, TingTing

Book ID: 115488610
Publisher: IEEE
Year: 2011
Weight: 664 KB
Volume: 0
Category: Article
ISBN: 1424485002
DOI: 10.1109/vdat.2011.5783579

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