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[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou, China (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement

✍ Scribed by Mahmood, Farhan Zaheed; Toyota, Yoshitaka; Iokibe, Kengo; Kondo, Koichi; Yoshida, Shigeyoshi

Book ID: 120970664
Publisher: IEEE
Year: 2011
Weight: 261 KB
Category: Article
ISBN: 146732289X
DOI: 10.1109/EDAPS.2011.6213804

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