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[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Derivation of the full-wave equivalent model of via hole in a two-layered substrate

✍ Scribed by Zhongxiang Shen, ; Qi Zhang,

Book ID: 120007134
Publisher: IEEE
Year: 2011
Weight: 176 KB
Category: Article
ISBN: 146732289X
DOI: 10.1109/EDAPS.2011.6213745

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