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[IEEE 2011 22nd Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Saratoga Springs, NY, USA (2011.05.16-2011.05.18)] 2011 IEEE/SEMI Advanced Semiconductor Manufacturing Conference - Parasitics extraction, wideband modeling and sensitivity analysis of through-strata-via (TSV) in 3D integration/packaging

✍ Scribed by Xu, Zheng; Gu, Xiaoxiong; Lu, Jian-Qiang

Book ID: 120007129
Publisher: IEEE
Year: 2011
Weight: 550 KB
Category: Article
ISBN: 1612844081
DOI: 10.1109/ASMC.2011.5898175

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