[IEEE 2010 IEEE International Symposium on Electrical Insulation (ISEI) - San Diego, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Symposium on Electrical Insulation - Study on thermal model of dynamic temperature calculation of single-core cable based on Laplace calculation method

✍ Scribed by Lei, Ming; Liu, Gang; Lai, Yu-ting; Li, Jin-zhu; Li, Wenxiang; Liu, Yi-gang

• Book ID: 115442401
• Publisher: IEEE
• Year: 2010
• Weight: 324 KB
• Volume: 0
• Category: Article
• ISBN: 1424462983
• DOI: 10.1109/elinsl.2010.5549825