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[IEEE 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Austin, TX, USA (2010.10.25-2010.10.27)] 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems - Through silicon via (TSV) shielding structures

โœ Scribed by Cho, Jonghyun; Kim, Joohee; Song, Taigon; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Park, Kunwoo


Book ID
121793954
Publisher
IEEE
Year
2010
Weight
720 KB
Category
Article
ISBN
1424468655

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