𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Austin, TX, USA (2010.10.25-2010.10.27)] 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems - Through silicon via (TSV) shielding structures

✍ Scribed by Cho, Jonghyun; Kim, Joohee; Song, Taigon; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Park, Kunwoo

Book ID: 121793954
Publisher: IEEE
Year: 2010
Weight: 720 KB
Category: Article
ISBN: 1424468655
DOI: 10.1109/EPEPS.2010.5642590

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2010 IEEE 19th Conference on Elect

[IEEE 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Austin, TX, USA (2010.10.25-2010.10.27)] 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems - Driver design for DDR4 memory subsystems

✍ Pham, Nam; Dreps, Daniel; Mandrekar, Rohan; Na, Nanju 📂 Article 📅 2010 🏛 IEEE ⚖ 404 KB

[IEEE 2010 IEEE 19th Conference on Elect

[IEEE 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Austin, TX, USA (2010.10.25-2010.10.27)] 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems - Parametric model order reduction from measurements

✍ Lefteriu, S.; Antoulas, A. C.; Ionita, A.C. 📂 Article 📅 2010 🏛 IEEE ⚖ 322 KB

[IEEE 2010 IEEE 19th Conference on Elect

[IEEE 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Austin, TX, USA (2010.10.25-2010.10.27)] 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems - Modeling of multilayered media using effective medium theory

✍ Hu, Fu-Gang; Song, Jiming; Kamgaing, Telesphor 📂 Article 📅 2010 🏛 IEEE ⚖ 561 KB

[IEEE 2010 IEEE 19th Conference on Elect

[IEEE 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Austin, TX, USA (2010.10.25-2010.10.27)] 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems - Physically-consistent broadband material models for transmission lines on FR-4

✍ Wells, Lionelle F.; Melde, Kathleen L. 📂 Article 📅 2010 🏛 IEEE ⚖ 205 KB

[IEEE 2010 IEEE 19th Conference on Elect

[IEEE 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Austin, TX, USA (2010.10.25-2010.10.27)] 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems - Causality checking and enhancement of 3D electromagnetic simulation data

✍ Young, Brian; Bhandal, Amarjit S 📂 Article 📅 2010 🏛 IEEE ⚖ 376 KB

[IEEE 2010 IEEE 19th Conference on Elect

[IEEE 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Austin, TX, USA (2010.10.25-2010.10.27)] 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems - Crosstalk mitigation of high-speed interconnects with discontinuities using modal signaling

✍ Milosevic, Pavle; Schutt-Aine, Jose E.; Beyene, Wendemagegnehu T. 📂 Article 📅 2010 🏛 IEEE ⚖ 659 KB