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[IEEE 2010 33rd International Spring Seminar on Electronics Technology (ISSE) - Warsaw, Poland (2010.05.12-2010.05.16)] 33rd International Spring Seminar on Electronics Technology, ISSE 2010 - Filling volume sensor for microfluidic applications based on thermic transient effect and standard PCB technology

✍ Scribed by Gross, Peter; Ender, Ferenc; Santha, Hunor


Book ID
115485689
Publisher
IEEE
Year
2010
Weight
360 KB
Volume
0
Category
Article
ISBN
1424478499

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