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[IEEE 2010 33rd International Spring Seminar on Electronics Technology (ISSE) - Warsaw, Poland (2010.05.12-2010.05.16)] 33rd International Spring Seminar on Electronics Technology, ISSE 2010 - Packaging and thermal analysis of power electronics modules

✍ Scribed by Man, Lucian; Farcas, Cristian; Fizesan, Raul

Book ID: 115492881
Publisher: IEEE
Year: 2010
Weight: 819 KB
Volume: 0
Category: Article
ISBN: 1424478499
DOI: 10.1109/isse.2010.5547296

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