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[IEEE 2009 IEEE International Symposium on Electromagnetic Compatibility - EMC 2009 - Austin, TX, USA (2009.08.17-2009.08.21)] 2009 IEEE International Symposium on Electromagnetic Compatibility - Investigation of mixed-mode input impedance of multi-layer differential vias for impedance matching with traces

โœ Scribed by Wang, Hanfeng; Cheng, Wheling; Zhang, Jianmin; Fisher, John; Zhu, Lin; Drewniak, James L.; Fan, Jun


Book ID
111875658
Publisher
IEEE
Year
2009
Weight
617 KB
Volume
0
Category
Article
ISBN
1424442664

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