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[IEEE 2009 IEEE International Symposium on Electromagnetic Compatibility - EMC 2009 - Austin, TX, USA (2009.08.17-2009.08.21)] 2009 IEEE International Symposium on Electromagnetic Compatibility - Lumped models for Vias in multilayered PCBs

✍ Scribed by Heinrich, Gerd; Dickmann, Stefan

Book ID: 121197234
Publisher: IEEE
Year: 2009
Weight: 183 KB
Category: Article
ISBN: 1424442664
DOI: 10.1109/ISEMC.2009.5284700

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