[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Stress sensitivity analysis on TSV structure of wafer-on-a-wafer (WOW) by the finite element method (FEM)

✍ Scribed by Kitada, H.; Maeda, N.; Fujimoto, K.; Suzuki, K.; Kawai, A.; Arai, K.; Suzuki, T.; Nakamura, T.; Ohba, T.

• Book ID: 126637605
• Publisher: IEEE
• Year: 2009
• Weight: 716 KB
• Category: Article
• ISBN: 1424444926
• DOI: 10.1109/IITC.2009.5090354