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[IEEE 2009 IEEE Electrical Insulation Conference (EIC) (Formerly EIC/EME) - Montreal, QC, Canada (2009.05.31-2009.06.3)] 2009 IEEE Electrical Insulation Conference - Use of finite element analysis to obtain thermal ratings for high voltage cable joint bays

โœ Scribed by Pilgrim, J. A.; Swaffield, D. J.; Lewin, P. L.; Larsen, S. T.; Payne, D.


Book ID
121008691
Publisher
IEEE
Year
2009
Weight
404 KB
Category
Article
ISBN
1424439159

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