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[IEEE 2009 IEEE Electrical Insulation Conference (EIC) (Formerly EIC/EME) - Montreal, QC, Canada (2009.05.31-2009.06.3)] 2009 IEEE Electrical Insulation Conference - Toughness improvement in epoxy/anhydride formulations for electrical insulation

✍ Scribed by Valette, L.; Ji, D.; Li, Y. J.

Book ID: 121284355
Publisher: IEEE
Year: 2009
Weight: 432 KB
Category: Article
ISBN: 1424439159
DOI: 10.1109/EIC.2009.5166361

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