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[IEEE 2009 IEEE Circuits and Systems International Conference on Testing and Diagnosis - Chengdu , China (2009.04.28-2009.04.29)] 2009 IEEE Circuits and Systems International Conference on Testing and Diagnosis - Research on the Characteristic Test of Via Holes in Microwave Circuits

✍ Scribed by Tian, Yu; Liu, Yu; Tong, Ling; Liu, Jinxian

Book ID: 121793945
Publisher: IEEE
Year: 2009
Weight: 512 KB
Category: Article
ISBN: 1424425875
DOI: 10.1109/CAS-ICTD.2009.4960867

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