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[IEEE 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2009.10.19-2009.10.21)] 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems - Through silicon via (TSV) equalizer

✍ Scribed by Kim, Joohee; Song, Eakhwan; Cho, Jeonghyeon; Pak, Jim So; Lee, Junho; Lee, Hyungdong; Park, Kunwoo; Kim, Joungho

Book ID: 115491498
Publisher: IEEE
Year: 2009
Weight: 704 KB
Volume: 0
Category: Article
ISBN: 1424444470
DOI: 10.1109/epeps.2009.5338488

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