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✦ LIBER ✦

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Influence of cure dependency of molding compound properties on warpage and stress distribution during and after the encapsulation of electronics components

✍ Scribed by Falat, T.; Jansen, K.M.B.; de Vreugd, J.; Rzepka, S.

Book ID: 126740816
Publisher: IEEE
Year: 2009
Tongue: English
Weight: 308 KB
Category: Article
ISBN: 1424441609
DOI: 10.1109/ESIME.2009.4938460

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