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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Effects of warpage on fatigue reliability of solder bumps: Experimental and analytical studies

✍ Scribed by Wei Tan, ; Ume, I. Charles; Ying Hung, ; Wu, C. F. Jeff

Book ID: 120812281
Publisher: IEEE
Year: 2008
Weight: 540 KB
Category: Article
ISBN: 1424422302
DOI: 10.1109/ECTC.2008.4549959

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