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[IEEE 2008 26th International Conference on Microelectronics (MIEL 2008) - Nis, Serbia and Montenegro (2008.05.11-2008.05.14)] 2008 26th International Conference on Microelectronics - An improved understanding of IGBT behavior under thermal stress

✍ Scribed by Benbahouche, Ly.; Merabet, A.; Zegadi, A.

Book ID: 126647102
Publisher: IEEE
Year: 2008
Weight: 251 KB
Category: Article
ISBN: 142441881X
DOI: 10.1109/ICMEL.2008.4559255

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