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[IEEE 2007 IEEE International Symposium on Electromagnetic Compatibility - Honolulu, HI, USA (2007.07.9-2007.07.13)] 2007 IEEE International Symposium on Electromagnetic Compatibility - A Scalable Model of Board to FPC Interconnect Using Neural Networks

✍ Scribed by Hwangbo, Hoon; Kim, Jongmin; Shim, Minkyu; Lee, Jongsung; Lee, Hyungseok; Seol, Byongsu; Jung, Seungboo; Nah, Wansoo

Book ID: 126673681
Publisher: IEEE
Year: 2007
Weight: 672 KB
Category: Article
ISBN-13: 9781424413508
DOI: 10.1109/ISEMC.2007.84

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