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[IEEE 2007 9th International Conference - The Experience of Designing and Applications of CAD Systems in Microelectronics - Lviv, Ukraine (2007.2.19-2007.2.24)] 2007 9th International Conference - The Experience of Designing and Applications of CAD Systems in Microelectronics - Research of thermal processes in goffered heat sink

✍ Scribed by Gaponenko, Nikolay; Ogrenich, Eugeny

Book ID: 126730451
Publisher: IEEE
Year: 2007
Weight: 297 KB
Category: Article
DOI: 10.1109/CADSM.2007.4297561

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