✦ LIBER ✦

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Recent Advancement in Characterization, Modeling and Correlation for Power Distribution Network of FPGA and Structural ASIC Packages and Devices

✍ Scribed by Shi, Hong; Low, Hoon Ngik; Yew, Yeehuan

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2007 9th Electronics Packaging Tec

✍ Oppermann, Martin; Lenk, Andreas; Schonecker, Andreas; Schuh, Carsten; Zerna, Th 📂 Article 📅 2007 🏛 IEEE ⚖ 741 KB

[IEEE 2007 9th Electronics Packaging Tec

✍ Henry, D.; Baillin, X.; Lapras, V.; Sillon, N.; Dunne, B.; Hernandez, C.; Vigier 📂 Article 📅 2007 🏛 IEEE ⚖ 608 KB

[IEEE 2007 9th Electronics Packaging Tec

✍ Yin, Beth Yam Wei 📂 Article 📅 2007 🏛 IEEE ⚖ 310 KB

[IEEE 2007 9th Electronics Packaging Tec

✍ Teixeira, R. C.; De Munck, K.; Baert, K.; Swinnen, B.; Knuttel, A.; De Moor, P. 📂 Article 📅 2007 🏛 IEEE ⚖ 543 KB

[IEEE 2007 9th Electronics Packaging Tec

✍ Srikanth, Narasimalu; Premkumar, J.; Sivakumar, M.; Wong, Y. M.; Vath, C. J. 📂 Article 📅 2007 🏛 IEEE ⚖ 500 KB

[IEEE 2007 9th Electronics Packaging Tec

✍ Lai, Yi-Shao; Yang, Ping-Feng; Jian, Sheng-Rui 📂 Article 📅 2007 🏛 IEEE ⚖ 770 KB