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[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Investigation of mechanical properties of black diamond tm (low-K) thin films for Cu/low-k interconnect applications

✍ Scribed by Sekhar, V.; Balakumar, S.; Chai, T.; Tay, Andrew

No coin nor oath required. For personal study only.

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