[IEEE 2005 6th International Conference
โฆ LIBER โฆ
[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - A new solder bumping technology with local induction heating
โ Scribed by An Rong, ; Mingyu Li, ; Chunqing Wang,
- Book ID
- 125443716
- Publisher
- IEEE
- Year
- 2005
- Weight
- 730 KB
- Category
- Article
- ISBN-13
- 9780780394490
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