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[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - System in package (SiP) technology applications

✍ Scribed by Wei Koh,

Book ID: 121299627
Publisher: IEEE
Year: 2005
Weight: 733 KB
Category: Article
ISBN-13: 9780780394490
DOI: 10.1109/ICEPT.2005.1564753

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