[IEEE 2005 6th International Conference
โฆ LIBER โฆ
[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - The thermo-physical properties of high dense Mo/Cu composites fabricated by squeeze casting technology
โ Scribed by Guoqin Chen, ; Gaohui Wu, ; Dezi Zhu, ; Qiang Zhang,
- Book ID
- 121264047
- Publisher
- IEEE
- Year
- 2005
- Weight
- 365 KB
- Category
- Article
- ISBN-13
- 9780780394490
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
[IEEE 2005 6th International Conference
โ
Mingxiang Chen, ; Xinjian Yi, ; Liulin Yuan, ; Zhiyin Gan, ; Sheng liu,
๐
Article
๐
2005
๐
IEEE
โ 464 KB
[IEEE 2005 6th International Conference
โ
Liu, X.; Hughes, L.C.; Rasmussen, M.H.; Hu, M.H.; Bhagavatula, V.A.; Davis, R.W.
๐
Article
๐
2005
๐
IEEE
โ 928 KB
[IEEE 2005 6th International Conference
โ
Zhang Peng, ; Zuo Chuncheng, ; Zhou Deyi, ; Chen Hongli, ; Liu Yan,
๐
Article
๐
2005
๐
IEEE
โ 581 KB
[IEEE 2005 6th International Conference
โ
Xiaojun Wang, ; Rongfeng Guan, ; Zhiyan Gan, ; Sheng Liu,
๐
Article
๐
2005
๐
IEEE
โ 244 KB
[IEEE 2005 6th International Conference
โ
Zetao Ma, ; Xiaojun Wang, ; Daqing Zhu, ; Sheng Liu,
๐
Article
๐
2005
๐
IEEE
โ 318 KB