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[IEEE 2004 International Conference on the Business of Electronic Product Reliability and Liability - Shanghai, China (27-30 April 2004)] Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) - Study on plasma cleaning and strength of wire bonding

✍ Scribed by Guan Rongfeng, ; Wang Xuefang, ; Zhu Fulong, ; Gan Zhiyin, ; Liu Sheng, ; Huang Dexiu,

Book ID: 120214717
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 313 KB
Category: Article
ISBN-13: 9780780383616
DOI: 10.1109/BEPRL.2004.1308151

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