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[IEEE 2001 IEEE Hong Kong Electron Devices Meeting - Hong Kong, China (30 June 2001)] Proceedings 2001 IEEE Hong Kong Electron Devices Meeting (Cat. No.01TH8553) - Characterization of piezoelectric ring used for wire bonding transducer application

✍ Scribed by Kei Chun Cheng, ; Chan, H.L.W.

Book ID: 120972837
Publisher: IEEE
Year: 2001
Tongue: English
Weight: 288 KB
Category: Article
ISBN-13: 9780780367142
DOI: 10.1109/HKEDM.2001.946919

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