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[IEEE 2000 International Conference on Simulation of Semiconductor Processes and Devices - Seattle, WA, USA (6-8 Sept. 2000)] 2000 International Conference on Simulation Semiconductor Processes and Devices (Cat. No.00TH8502) - A multi-scale random-walk thermal-analysis methodology for complex IC-interconnect systems

✍ Scribed by Iverson, R.B.; Le Coz, Y.L.; Kleveland, B.; Wong, S.S.

Book ID: 126667154
Publisher: IEEE
Year: 2000
Weight: 298 KB
Category: Article
ISBN-13: 9780780362796
DOI: 10.1109/SISPAD.2000.871212

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