[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - Microwave multichip modules using low cost microwave chip on flex packaging technology

[IEEE 1998 International Conference on M

[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - Replaceable chip module (RCM/sup TM/)

✍ Rathburn, J. 📂 Article 📅 1998 🏛 IEEE ⚖ 691 KB

[IEEE 1998 International Conference on M

[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - Multichip-modules (MCMs) for micro- and millimeter-wave applications-a challenge?

✍ Oppermann, M. 📂 Article 📅 1998 🏛 IEEE ⚖ 665 KB

[IEEE 1998 International Conference on M

[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - Thin film passive elements on polyimide film

✍ Saia, R.J.; Cole, H.S.; Durocher, K.M.; Nielsen, M.C. 📂 Article 📅 1998 🏛 IEEE ⚖ 506 KB

[IEEE 1998 International Conference on M

[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - Study of RF flip-chip assembly with underfill epoxy

✍ Zhang, W.; Su, B.; Feng, Z.; Gupta, K.C.; Lee, Y.C. 📂 Article 📅 1998 🏛 IEEE 🌐 English ⚖ 540 KB

now In Its Seventh Year, Mcm Has Expanded To Reflect The Evolution And Applications Since 1992. The Mcms Most Commonly Envisioned In 1992 Interconnected 60 To 100 Chips On A Thin Film Substrate.

[IEEE 1998 International Conference on M

[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - A system level approach to a structured MCM design methodology

✍ Ringroot, E.; Truzzi, C.; Beyne, E. 📂 Article 📅 1998 🏛 IEEE 🌐 English ⚖ 853 KB

now In Its Seventh Year, Mcm Has Expanded To Reflect The Evolution And Applications Since 1992. The Mcms Most Commonly Envisioned In 1992 Interconnected 60 To 100 Chips On A Thin Film Substrate.

[IEEE 1998 International Conference on M

[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - High frequency IC to IC signaling on rapidly prototyped flip chip MCM-D substrate

✍ Reed, J.D.; Caldwell, G.; Wang, M.; Hirsch, T.; Yee, I.; Lunceford, B.; Somadder 📂 Article 📅 1998 🏛 IEEE 🌐 English ⚖ 942 KB

now In Its Seventh Year, Mcm Has Expanded To Reflect The Evolution And Applications Since 1992. The Mcms Most Commonly Envisioned In 1992 Interconnected 60 To 100 Chips On A Thin Film Substrate.