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[IEEE 1997 IEEE Ultrasonics Symposium An International Symposium - Toronto, Ont., Canada (5-8 Oct. 1997)] 1997 IEEE Ultrasonics Symposium Proceedings. An International Symposium (Cat. No.97CH36118) - A novel temperature compensation method for SAW devices using direct bonding techniques

✍ Scribed by Onishi, K.; Namba, A.; Sato, H.; Ogura, T.; Seki, S.; Taguchi, Y.; Tomita, Y.; Kawasaki, O.; Eda, K.

Book ID: 111973517
Publisher: IEEE
Year: 1997
Weight: 250 KB
Volume: 1
Category: Article
ISBN-13: 9780780341531
DOI: 10.1109/ultsym.1997.663015

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