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[IEEE 1997 47th Electronic Components and Technology Conference - San Jose, CA, USA (18-21 May 1997)] 1997 Proceedings 47th Electronic Components and Technology Conference - A novel die bonding adhesive-silver filled film

✍ Scribed by Takeda, S.; Masuko, T.; Miyadera, Y.; Yamazaki, M.; Maekawa, I.

Book ID: 127345068
Publisher: IEEE
Year: 1997
Weight: 415 KB
Category: Article
ISBN-13: 9780780338579
DOI: 10.1109/ectc.1997.606218

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