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[IEEE 1997 47th Electronic Components and Technology Conference - San Jose, CA, USA (18-21 May 1997)] 1997 Proceedings 47th Electronic Components and Technology Conference - Modeling and experimental validation of interconnects with meshed power planes

✍ Scribed by Li, Y.L.; Bradawy, E.L.; Sharawy, E.L.; Polka, L.; Madrid, A.; Liao, J.C.; Figueroa, D.

Book ID: 118129437
Publisher: IEEE
Year: 1997
Weight: 388 KB
Volume: 0
Category: Article
ISBN-13: 9780780338579
DOI: 10.1109/ectc.1997.606321

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