𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems - Austin, TX, USA (5-8 Feb. 1992)] [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems - Enhanced nucleate boiling in structured surfaces

✍ Scribed by Cho, C.S.K.; Hwang, Q.N.; Reddy, R.K.; Ayub, Z.H.

Book ID: 120617010
Publisher: IEEE
Year: 1992
Tongue: English
Weight: 394 KB
Category: Article
ISBN-13: 9780780305038
DOI: 10.1109/ITHERM.1992.187748

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE [1992 Proceedings] Intersociety Co

[IEEE [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems - Austin, TX, USA (5-8 Feb. 1992)] [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems - Effect of microscale thermal conduction on the packing limit of silicon-on-insulator electronics

✍ Goodson, K.E.; Flik, M.I. 📂 Article 📅 1992 🏛 IEEE 🌐 English ⚖ 557 KB

[IEEE [1992 Proceedings] Intersociety Co

[IEEE [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems - Austin, TX, USA (5-8 Feb. 1992)] [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems - Optimization of heat sink fin geometries for heat sinks in natural convection

✍ Morrison, A.T. 📂 Article 📅 1992 🏛 IEEE 🌐 English ⚖ 335 KB

[IEEE [1992 Proceedings] Intersociety Co

[IEEE [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems - Austin, TX, USA (5-8 Feb. 1992)] [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems - A coupled thermal-magnetic model for high frequency transformers. I. Model formulation and material properties

✍ Nelson, D.J.; Jessee, J.P. 📂 Article 📅 1992 🏛 IEEE 🌐 English ⚖ 855 KB

[IEEE 1994 4th Intersociety Conference o

[IEEE 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) - Washington, DC, USA (4-7 May 1994)] Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) - Gas-assisted evaporative cooling of high density electronic modules

✍ Bar-Cohen, A.; Sherwood, G.; Hodes, M. 📂 Article 📅 1994 🏛 IEEE ⚖ 810 KB

[IEEE 2010 12th IEEE Intersociety Confer

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -

✍ Patel, Chandradip; McCluskey, Patrick; Lemus, David 📂 Article 📅 2010 🏛 IEEE ⚖ 605 KB

[IEEE 2012 13th IEEE Intersociety Confer

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Nanoscale conformable coatings for enhanced thermal conduction of carbon nanotube films

✍ Marconnet, Amy M.; Motoyama, Munekazu; Barako, Michael T.; Yuan Gao, ; Pozder, S 📂 Article 📅 2012 🏛 IEEE ⚖ 837 KB