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[IEEE [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems - Austin, TX, USA (5-8 Feb. 1992)] [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems - Effect of microscale thermal conduction on the packing limit of silicon-on-insulator electronics

✍ Scribed by Goodson, K.E.; Flik, M.I.

Book ID: 115541722
Publisher: IEEE
Year: 1992
Tongue: English
Weight: 557 KB
Volume: 0
Category: Article
ISBN-13: 9780780305038
DOI: 10.1109/itherm.1992.187749

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