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[IEEE 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest - Maastricht, Netherlands (25-29 Jan. 2004)] 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest - Localized induction heating solder bonding for wafer level MEMS packaging

✍ Scribed by Hsueh-An Yang, ; Mingching Wu, ; Weileun Fang,

Book ID: 121724777
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 320 KB
Category: Article
ISBN-13: 9780780382657
DOI: 10.1109/MEMS.2004.1290688

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