𝔖 Bobbio Scriptorium

✦ LIBER ✦

Hybrid microelectronics bonding and packaging techniques : M. Ohanian, Proc. 1966 Electronic Components Conf., Washington DC, p. 250

Publisher: Elsevier Science
Year: 1967
Tongue: English
Weight: 99 KB
Volume: 6
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(67)90257-0

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