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Packaging multiple assemblies of integrated circuit dice : W. H. Hall and M. Shannon, Proc. 1966 Electronic Components Conf., Washington DC, p. 259

Publisher: Elsevier Science
Year: 1967
Tongue: English
Weight: 59 KB
Volume: 6
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(67)90259-4

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📂 Article 📅 1967 🏛 Elsevier Science 🌐 English ⚖ 155 KB