The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, clean
Hybrid microcircuit technology handbook: materials, processes, design, testing and production
โ Scribed by James J Licari; Leonard R Enlow
- Publisher
- Noyes Publicatons
- Year
- 1998
- Tongue
- English
- Leaves
- 584
- Series
- Materials science and process technology series
- Category
- Library
No coin nor oath required. For personal study only.
โฆ Synopsis
Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, chapters on substrate selections, handling (including Read more...
โฆ Table of Contents
Content: Introduction --
Substrates --
Thin Film Processes --
Thick Film Processes --
Resistor Trimming --
Parts Selection --
Assembly Processes --
Testing --
Handling and Clean Rooms --
Design Guidelines --
Documentation and Specifications --
Failure Analysis --
Multichip Modules: A New Breed of Hybrid Microcircuits --
References --
Index.
Abstract: Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines is also present
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<p>This book is derived from a recent project sponsored by the Polymer Engineering Directorate of the SERC and carried out at the University of Lancaster under the joint auspices of the Departments of Chemistry and Engineering. The project set out to provide a novel type of teaching material for int
This handbook is a broad review of semiconductor materials and process technology, with emphasis on very large-scale integration (VLSI) and ultra large scale integration (ULSI). The technology of integrated circuit (IC) processing is expanding so rapidly that it can be difficult for the scientist wo
This handbook is a broad review of semiconductor materials and process technology, with emphasis on very-large-scale integration (VLSI) and ultra-large-scale integration (ULSI). The technology of integrated circuit (IC) processing is expanding so rapidly that it can be difficult for the scientist wo