๐”– Scriptorium
โœฆ   LIBER   โœฆ

๐Ÿ“

Hybrid microcircuit technology handbook: materials, processes, design, testing and production

โœ Scribed by James J Licari; Leonard R Enlow


Publisher
Noyes Publicatons
Year
1998
Tongue
English
Leaves
584
Series
Materials science and process technology series
Category
Library

โฌ‡  Acquire This Volume

No coin nor oath required. For personal study only.

โœฆ Synopsis


Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, chapters on substrate selections, handling (including Read more...

โœฆ Table of Contents



Content: Introduction --
Substrates --
Thin Film Processes --
Thick Film Processes --
Resistor Trimming --
Parts Selection --
Assembly Processes --
Testing --
Handling and Clean Rooms --
Design Guidelines --
Documentation and Specifications --
Failure Analysis --
Multichip Modules: A New Breed of Hybrid Microcircuits --
References --
Index.
Abstract: Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines is also present


๐Ÿ“œ SIMILAR VOLUMES


Hybrid Microcircuit Technology Handbook
โœ Licari, J.J.; Enlow, L.R. ๐Ÿ“‚ Library ๐Ÿ“… 1998 ๐Ÿ› William Andrew Publishing/Noyes ๐ŸŒ English

The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, clean

Polymer Products: Design, Materials and
โœ David H. Morton-Jones, John W. Ellis (auth.) ๐Ÿ“‚ Library ๐Ÿ“… 1986 ๐Ÿ› Springer Netherlands ๐ŸŒ English

<p>This book is derived from a recent project sponsored by the Polymer Engineering Directorate of the SERC and carried out at the University of Lancaster under the joint auspices of the Departments of Chemistry and Engineering. The project set out to provide a novel type of teaching material for int

Semiconductor Materials and Process Tech
โœ Gary F. McGuire, Gary F. McGuire ๐Ÿ“‚ Library ๐Ÿ“… 1989 ๐Ÿ› William Andrew ๐ŸŒ English

This handbook is a broad review of semiconductor materials and process technology, with emphasis on very large-scale integration (VLSI) and ultra large scale integration (ULSI). The technology of integrated circuit (IC) processing is expanding so rapidly that it can be difficult for the scientist wo

Semiconductor Materials and Process Tech
โœ McGuire, G.E.(eds.) ๐Ÿ“‚ Library ๐Ÿ“… 1988 ๐Ÿ› William Andrew Publishing/Noyes ๐ŸŒ English

This handbook is a broad review of semiconductor materials and process technology, with emphasis on very-large-scale integration (VLSI) and ultra-large-scale integration (ULSI). The technology of integrated circuit (IC) processing is expanding so rapidly that it can be difficult for the scientist wo