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Highly integrated millimeter-wave passive components using 3-D LTCC system-on-package (SOP) technology

โœ Scribed by Jong-Hoon Lee, ; DeJean, G.; Sarkar, S.; Pinel, S.; Kyutae Lim, ; Papapolymerou, J.; Laskar, J.; Tentzeris, M.M.


Book ID
118021853
Publisher
IEEE
Year
2005
Tongue
English
Weight
1020 KB
Volume
53
Category
Article
ISSN
0018-9480

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