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3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology

✍ Scribed by Tentzeris, M.M.; Laskar, J.; Papapolymerou, J.; Pinel, S.; Palazzari, V.; Li, R.; DeJean, G.; Papageorgiou, N.; Thompson, D.; Bairavasubramanian, R.; Sarkar, S.; Lee, J.-H.

Book ID: 118254036
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 917 KB
Volume: 27
Category: Article
ISSN: 1521-3323
DOI: 10.1109/tadvp.2004.828814

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