✦ LIBER ✦

High thermal conductivity aluminum nitride ceramic substrates and packages

✍ Scribed by Miyashiro, F.; Iwase, N.; Tsuge, A.; Ueno, F.; Nakahashi, M.; Takahashi, T.

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

High thermal conductivity aluminum nitri

📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 133 KB

Microstructural Characterization of High

✍ Hiromi Nakano; Koji Watari; Hiroyuki Hayashi; Kazuyori Urabe 📂 Article 📅 2004 🏛 John Wiley and Sons 🌐 English ⚖ 276 KB

High Thermal Conductivity Aluminum Nitri

✍ Xiaojun Luo; Jun Li; Baolin Zhang; Wenlan Li; Hanrui Zhuang 📂 Article 📅 2006 🏛 John Wiley and Sons 🌐 English ⚖ 502 KB

Development and Microstructural Characte

✍ YASUHIRO KUROKAWA; KAZUAKI UTSUMI; HIDEO TAKAMIZAWA 📂 Article 📅 1988 🏛 John Wiley and Sons 🌐 English ⚖ 902 KB

Thermal conductivity of ceramics based o

✍ Yu. G. Duderov; A. K. Kiryutin 📂 Article 📅 1970 🏛 Springer US 🌐 English ⚖ 156 KB

High thermal-shock resistance of aluminu

✍ F. A. Fekhretdinov; V. B. Kalinin; Yu. I. Vikhrev 📂 Article 📅 1980 🏛 Springer US 🌐 English ⚖ 380 KB