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High thermal conductivity aluminum nitride ceramic substrates and packages : Fumio Miyashiroet al. IEEE Trans. Compon. Hybrids mfg Technol.13(2), 313 (1990)

Publisher: Elsevier Science
Year: 1992
Tongue: English
Weight: 133 KB
Volume: 32
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(92)90204-x

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