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High-Speed Slicing of SiC Ingot by High-Speed Multi Wire Saw

โœ Scribed by Maeda, Hiroto; Takanabe, Ryuichi; Takeda, Atsunori; Matsuda, Syogo; Kato, Tomohisa

Book ID
126892491
Publisher
Trans Tech Publications, Ltd.
Year
2014
Tongue
English
Weight
380 KB
Volume
778-780
Category
Article
ISSN
1662-9752

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โœ W. Wang; Z.D. Liu; Z.J. Tian; Y.H. Huang; Z.X. Liu ๐Ÿ“‚ Article ๐Ÿ“… 2009 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 972 KB

As the semiconductor industry requires the cutting of silicon ingots into wafers, the slicing of large, ultra thin wafers is one of the main technologies to prevent wastage. Recently, apart from conventional inner diameter (ID) blade and multi-wire saw methods, wire electrical discharge machining (W