High Speed Serdes Devices and Applications

✍ Scribed by James Donald Rockrohr, Amanullah Mohammad, Clarence Rosser Ogilvie, Kent Dramstad, Michael A. Sorna, Jeanne Trinko Mechler, David Robert Stauffer (auth.)

• Publisher: Springer US
• Year: 2009
• Tongue: English
• Leaves: 494
• Edition: 1
• Category: Library

✦ Synopsis

High Speed Serdes Devices and Applications provides a broad understanding of High Speed Serdes (HSS) device usage. The material focuses on HSS devices, and the consolidation of related topics into a single text. Chip and system designers using HSS devices must have detailed knowledge of both the features and functions of the HSS device, and the applications in which they are used. Also designers must have a working knowledge of related subjects, including: reference clock architectures, signal integrity, power dissipation, and test features and functions. The authors consolidate these topics with a specific focus on HSS devices. This approach provides the chip designer sufficient background information for using HSS devices on their chips.

The chapters can be viewed as four distinct sections. The first section relates to the features, functions, and design of HSS devices. Second are chapters that describe the features and functions of protocol logic used to implement various network protocol interface standards. The third section covers specialized topics related to HSS cores. Finally, characteristics of typical design kit models to facilitate integration within the chip design are discussed.

High Speed Serdes Devices and Applications is a useful resource for chip designers using HSS devices in their chip design.

✦ Table of Contents

Front Matter....Pages i-xiv
Serdes Concepts....Pages 1-29
HSS Features and Functions....Pages 31-98
HSS Architecture and Design....Pages 99-124
Protocol Logic and Specifications....Pages 125-164
Overview of Protocol Standards....Pages 165-261
Reference Clocks....Pages 263-296
Test and Diagnostics....Pages 297-344
Signal Integrity....Pages 345-396
Power Analysis....Pages 397-424
Chip Integration....Pages 425-474
Back Matter....Pages 475-484

✦ Subjects

Circuits and Systems; Electronics and Microelectronics, Instrumentation; Engineering, general; Electrical Engineering